onsemi launched newest generation of silicon and silicon carbide hybrid power integrated modules (PIMs) in F5BP packaging to boost Solar Power Generation and Energy Storage.

Infineon Technologies introduced the low-power 1200V CIPOS™ Maxi Intelligent Power Module (IPM) family for motor drivers.

Samsung Electronics ended five quarters of losses with an operating profit of 1.91 trillion won in 2024 Q1. If its semiconductor department achieves over 28.5 trillion won, it will surpass TSMC to regain world leadership.

The application of AI chips in intelligent driving, including environmental perception, path planning and decision-making, vehicle control, etc. How do AI chips impact the future of Automotive?

Resistors, capacitors, and inductors are the most usual passive electronic components. How important are they in the electric circuits?

DSPIC30F2010-30I/SP is a Digital Signal Controller (DSC) that contains Digital Signal Processing (DSP) functionality within a high-performance 16-bit microcontroller (MCU) architecture.

From Wireless Communication to IoT, how Radio Frequency Integrated Circuits (RFIC) is Shaping the Future with AI Technologies?

Digital isolators are important in improving circuit stability and safety. It is mainly used in industrial, automotive, consumer electronics, and medical applications.

Infineon has developed dual-DPAK (DDPAK) and quad-DPAK (QDPAK) SiC devices that feature top-side cooling (TSC) technology.

2024Q1 global semiconductor industry sales and electronic components market demand overview.

With government subsidies, manufacturers such as Intel, TSMC, and Samsung have begun a new round of factory construction and production expansion, expanding their layout to seize the market.

Product details of STM32F103C8T6 32-bit Arm Cortex-M3 core microcontroller about its features and applications.

NVIDIA released a new generation of Blackwell B200 GPU architecture for running AI models at the GTC 2024.

How to select a ceramic capacitor that can maintain optimum performance in high temperature applications?

ASIC (Application Specific Integrated Circuits) is the core of Future AI development. Will it substitute GPU or FPGA?

Global semiconductor monthly wafer (WPM) production capacity increased by 5.5% to 29.6 million pieces in 2023. In 2024, it is expected to increase by 6.4% to 30 million wafers per month

Infineon launches TRAVEOTM T2G-C series automotive microcontrollers (MCUs) features new graphics engine uses intelligent rendering technology to bring outstanding performance to automotive graphics applications.

The market for Power Management ICs has been sluggish this year. TI and ADI have successively taken price reduction measures to seize the market.

Nexperia announced its first silicon carbide (SiC) MOSFETs to match the needs of the electric vehicle market.

AEC-Q200 Rev E standard includes test requirements for Fuses. Littelfuse is one of the first manufacturers that has released AEC-Q200 certified Fuse portfolio.