Infineon Technologies has expanded its seventh generation TRENCHSTOP™ IGBT7 product family by introducing the low-power CIPOS™ Maxi Intelligent Power Module (IPM) family for motor drivers. The new IM12BxxxC1 family is based on the latest TRENCHSTOP IGBT7 1200 V and fast diode EmCon 7 technology.
High-Performance CIPOS™ Maxi
The portfolio includes the IM12B10CC1, IM12B15CC1, and IM12B20EC1, with current specifications ranging from 10A to 20A and output power up to 4.0kW. The product family uses the latest micro-groove design, greatly reducing losses and improving efficiency and power density.
Source from Infineon
The IM12BxxxC1 series is packaged in DIP 36x23D. It integrates various control and power components to improve reliability, optimize PCB size, and reduce system cost. It has the smallest package in 1200V IPM products. It also has the highest power density and best performance in its class. This series is ideal for low and medium-power driver applications such as motor drivers, pumps, fans, heat pumps, and outdoor fans for heating, ventilation, and air conditioning.
This series features an isolated dual in-line molded case with excellent thermal performance and electrical isolation. The three-phase inverter with 1200V TRENCHSTOP™ IGBTs and emitter-controlled diodes is combined with an optimized 6-channel SOI gate driver to achieve excellent electrical performance.
It meets the EMI and overload protection requirements of demanding designs. In addition, the IPM is equipped with a UL-certified independent temperature thermistor. CIPOS™ Maxi integrates a rugged 6-channel SOI gate driver with built-in dead time to prevent transient damage. It features undervoltage lockout and overcurrent shutdown for all channels. With its multi-function pins, this IPM offers high design flexibility for a variety of applications. The lower bridge emitter pin can be used for all phase current monitoring, making the device easy to control.
Other News
After announcing 1,400 layoffs worldwide, Infineon completed the sale of its concept backend manufacturing plant to Taiwan-based ASE Semiconductor Manufacturing Services Provider for $64.22 million.
The two plants are located in Cavite, Philippines and Cheonan, South Korea. The plant in Cavite, Philippines focuses on lead frame packaging for automotive and industrial control chips. The plant in Cheonan, South Korea focuses on packaging and testing power chip modules for home appliances, industrial automation, and automotive applications.
ASE and Infineon have signed a long-term supply agreement, under which Infineon will continue to receive previously established services as well as services for future products to support its customers and fulfill existing commitments.
Infineon CEO Jochen Hanebeck said that as part of the previously announced cost-saving plan, Infineon will lay off 1,400 employees worldwide and relocate another 1,400 positions to countries with lower labor costs.
Infineon's financial report showed that its net profit in the third quarter was 403 million euros, a year-on-year decline of 52%, lower than the expected 447 million euros.