In 2024 Q1, Samsung Electronics' Device Solutions (DS) division achieved an operating profit of 1.91 trillion won, ending five quarters of losses. Since Samsung lost its industry leadership position in the third quarter of 2022, it has lagged behind TSMC for seven consecutive quarters.
With the recovery of the storage market and the surge in demand for AI chips, Samsung Electronics' performance began to rebound significantly. According to media reports, in the second quarter of 2024, Samsung Electronics’ semiconductor department is expected to surpass TSMC and become the world’s top semiconductor seller.
TSMC is far ahead in the foundry field with a market share of 61.7%, while Samsung is only 11%. In 2024 Q2, TSMC's revenue was NT$673.51 billion (about 28.5 trillion won), an increase of 32% over the same period in 2023. Samsung Electronics announced an operating profit of 10.4 trillion won in the second quarter, and its revenue increased by 23.31% year-on-year to 74 trillion won. The market estimates that Samsung's DS department's revenue in the second quarter will be about 27 trillion to 28 trillion won. South Korea's BNK Securities predicts at least 27 trillion won, and Hanwha Investment Securities predicts a maximum of 28.8 trillion won. If the final revenue announced exceeds 28.5 trillion won, it will surpass TSMC and have a chance to regain the throne of the world's leading semiconductor revenue.
Samsung HBM3 Memory Certified By NVIDIA
According to media reports, Samsung Electronics' HBM3 memory chip has passed NVIDIA's certification for the first time, but it will currently only be used on the H20 specifically for China. At the same time, supply chain news in Taiwan, China revealed that Samsung's HBM3E is expected to pass NVIDIA's certification in August and start supplying in the third quarter. However, Samsung Electronics has not yet reached the standards of NVIDIA's fifth-generation HBM3E chips and is continuing chip testing. In addition to Samsung, SK Hynix began supplying HBM3E to NVIDIA in March this year, and Micron also announced that it would supply HBM3E.
Source from Internet
High-bandwidth memory (HBM) is a dynamic random access memory that is a key component of artificial intelligence processors. It can process the large amounts of data generated by complex applications.
The booming development of AI is driving a surge in demand for high-performance, high-capacity semiconductors, which is affecting market dynamics. The semiconductor industry is also constantly developing, and the competition between Samsung and TSMC is intensifying. It also indirectly reflects the changing trend of the global landscape.