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XC2VP20-6FF1152I
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Product Details
XC2VP20-6FF1152I
IC FPGA 564 I/O 1152FCBGA
Manufacture: Xilinx Inc.
Category: Integrated Circuits
Description: IC FPGA 564 I/O 1152FCBGA
Package: 1152-BBGA, FCBGA
Video: XC2VP20-6FF1152I
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

The field-programmable gate array (FPGA) is place an important role in the development of various technological advancement. The feature of reprogrammed it have make it more flexible in customization, especially when deployed out in the field. The applications of FPGAs include Medical, automotive, video & image processing, telecom and datacom, server and cloud, defense and aerospace.

Reviews
MOREReviews
  • To***en
    Germany
    Package received.It's good.
    2023-06-30
  • Al***on
    Belarus
    Just a lot of low-power diodes and diodes, but we need to check them tester to which I have not yet reached =), good packaging. 10 pieces of checked-call believable. waiting for the device to test and determine the characteristics but otherwise satisfied.
    2021-03-27
  • Ol***er
    Switzerland
    The goods has arrived this morning. Thanks again for your kind support and thanks too for the very nice mouse pad - I like it very much
    2021-04-29
  • Th***ry
    France
    Got the package, thank you!
    2021-08-03
  • Do***er
    Germany
    It came very quickly,good service,thanks
    2024-06-12
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.
▪ Packing Condition Inspection and make sure all products are well anti-static sealed.
▪ Extensive views like printing and Pin checking under microscope for quality detection.
▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.
▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.

Package
Package