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XC2V2000-4FG676I
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Product Details
XC2V2000-4FG676I
IC FPGA 456 I/O 676FCBGA
Manufacture: Xilinx Inc.
Category: Integrated Circuits
Description: IC FPGA 456 I/O 676FCBGA
Package: 676-BGA
Video: XC2V2000-4FG676I
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

The field-programmable gate array (FPGA) is place an important role in the development of various technological advancement. The feature of reprogrammed it have make it more flexible in customization, especially when deployed out in the field. The applications of FPGAs include Medical, automotive, video & image processing, telecom and datacom, server and cloud, defense and aerospace.

Reviews
MOREReviews
  • Ja***ck
    Germany
    GOOD!
    2023-02-14
  • Ke***an
    United States
    We counted them, we tested two of them, they work well. Thank you. We also are delighted with the little piece of art you included in the package. We're not sure what it's for, but we have put it up on our notice board, because it is cute.
    2023-04-22
  • Sa***ra
    Spain
    Service was great!
    2023-11-21
  • De**is
    Spain
    Good!
    2021-11-05
  • Yu***ov
    Germany
    We've received from you qualitative parts. which has been used in manufacutre and devices work without problems. Separate thanks for gifts! They were nice. I hope for the further successful cooperation with your company this 2022!
    2022-01-12
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.
▪ Packing Condition Inspection and make sure all products are well anti-static sealed.
▪ Extensive views like printing and Pin checking under microscope for quality detection.
▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.
▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.

Package
Package