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ADP5302ACPZ-3-R7
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Product Details
ADP5302ACPZ-3-R7
50MA/500MA ULP BUCK VINOK ST VOU
Manufacture: Analog Devices Inc.
Category: Integrated Circuits
Description: 50MA/500MA ULP BUCK VINOK ST VOU
Package: 10-VFDFN Exposed Pad, CSP
Video: ADP5302ACPZ-3-R7
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
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Analog Devices, Inc. (ADI) specializes in data conversion, signal processing and power management technology. Its products include analog signal processing and digital signal processing technologies. Mainly used for communications, automotive, consumer electronics, military and aerospace applications.

Reviews
MOREReviews
  • Ja***ck
    Germany
    GOOD!
    2023-02-14
  • Mi***le
    Germany
    By the way you guys are the best who offer qualitied parts. Aside the good price,your quotation is fast and always have good answers to our questions.We are appreciated.
    2023-04-18
  • Va***na
    Italy
    Everything is good!
    2021-03-16
  • As***in
    Germany
    Thank you very much for your kind support so far!
    2021-09-29
  • Uw***er
    Germany
    If we need more parts, we will be happy to contact you immediately.
    2023-10-17
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' demanding quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

- Label verification according to datasheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.

- Packing Condition Inspection and make sure all products are well anti-static sealed.

- Extensive views like printing and Pin checking under microscope for quality detection.

- Digital photos of all outgoing Integrated Circuit Systems parts.


Package
Package

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