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ADP2106ACPZ-1.8-R7
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Product Details
ADP2106ACPZ-1.8-R7
IC REG BUCK 1.8V 1.5A 16LFCSP
Manufacture: Analog Devices Inc.
Category: Integrated Circuits
Description: IC REG BUCK 1.8V 1.5A 16LFCSP
Package: 16-WQFN Exposed Pad, CSP
Video: ADP2106ACPZ-1.8-R7
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
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Analog Devices, Inc. (ADI) specializes in data conversion, signal processing and power management technology. Its products include analog signal processing and digital signal processing technologies. Mainly used for communications, automotive, consumer electronics, military and aerospace applications.

Reviews
MOREReviews
  • Jo***er
    Germany
    I used one of the Darlington arrays (ULN2003) to make a relay module and tested an OP-amp in my line following robot. Every IC I have used so far works great.
    2021-09-09
  • I***0
    Czech-Republic
    The shipment has arrived. Thank you for the perfect support.
    2021-06-24
  • Ge***rd
    Denmark
    Thank you Vicky for great service.
    2021-02-05
  • Vi***ia
    Italy
    Received, good!
    2023-07-28
  • To***en
    Germany
    Package received.It's good.
    2023-06-30
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' demanding quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

- Label verification according to datasheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.

- Packing Condition Inspection and make sure all products are well anti-static sealed.

- Extensive views like printing and Pin checking under microscope for quality detection.

- Digital photos of all outgoing Integrated Circuit Systems parts.


Package
Package

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