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XC3S4000-4FGG676C
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Product Details
XC3S4000-4FGG676C
IC FPGA 489 I/O 676FBGA
Manufacture: Xilinx Inc.
Category: Integrated Circuits
Description: IC FPGA 489 I/O 676FBGA
Package: 676-BGA
Video: XC3S4000-4FGG676C
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

The field-programmable gate array (FPGA) is place an important role in the development of various technological advancement. The feature of reprogrammed it have make it more flexible in customization, especially when deployed out in the field. The applications of FPGAs include Medical, automotive, video & image processing, telecom and datacom, server and cloud, defense and aerospace.

Reviews
MOREReviews
  • Ra***na
    Switzerland
    Good!
    2023-07-18
  • Ke***rk
    Spain
    The goods are very good and works excellently. I'm very satisfied!
    2020-06-03
  • Ak***sh
    India
    I am very satisfy with the packaging and the service is good! I will order again.
    2022-08-30
  • Ni***le
    Germany
    The goods arrived us on Friday. It was a very short delivery time! Greatfully!!I'll contact again if we need any more goods.
    2022-05-28
  • Va***sa
    Malaysia
    Thank you for the service and fast cooperation. We received the goods well. And many thanks for the beautiful gift. If we search another component, we will certainly communicate again.
    2021-01-28
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.
▪ Packing Condition Inspection and make sure all products are well anti-static sealed.
▪ Extensive views like printing and Pin checking under microscope for quality detection.
▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.
▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.

Package
Package