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TPS62601YFFT
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Product Details
TPS62601YFFT
IC REG BUCK 1.8V 500MA 6DSBGA
Manufacture: Texas Instruments
Category: IC
Description: IC REG BUCK 1.8V 500MA 6DSBGA
Package: 6-UFBGA, DSBGA
Video: TPS62601YFFT
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

Power Management ICs of TI find the usage on helping engineers develop differentiated, innovative designs, from ultra-low-power wireless sensors to high-voltage GaN-based design. Its application areas cover Automotive, Communications equipment, Industrial, Consumer Electronics, Enterprise systems.

Reviews
MOREReviews
  • Va***na
    Italy
    Everything is good!
    2021-03-16
  • Mi***rl
    Italy
    Received quickly. Everything was working fine.
    2023-05-24
  • Th***ry
    France
    Got the package, thank you!
    2021-08-03
  • Ha***na
    Korea
    Fast delivery. All good!
    2022-11-19
  • Da***ne
    Lithuania
    Wishing you a good day ahead too!
    2023-05-10
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.
▪ Packing Condition Inspection and make sure all products are well anti-static sealed.
▪ Extensive views like printing and Pin checking under microscope for quality detection.
▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.
▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.

Package
Package