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TPS612532AYFFR
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Product Details
TPS612532AYFFR
3.8-MHZ, 5-V / 4-A BOOST IN 1.2-
Manufacture: Texas Instruments
Category: IC
Description: 3.8-MHZ, 5-V / 4-A BOOST IN 1.2-
Package: 9-UFBGA, DSBGA
Video: TPS612532AYFFR
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
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Power Management ICs of TI find the usage on helping engineers develop differentiated, innovative designs, from ultra-low-power wireless sensors to high-voltage GaN-based design. Its application areas cover Automotive, Communications equipment, Industrial, Consumer Electronics, Enterprise systems.

Reviews
MOREReviews
  • Fa***an
    Germany
    The chip is good!
    2022-05-28
  • Al***on
    Belarus
    Just a lot of low-power diodes and diodes, but we need to check them tester to which I have not yet reached =), good packaging. 10 pieces of checked-call believable. waiting for the device to test and determine the characteristics but otherwise satisfied.
    2021-03-27
  • Ch***en
    Germany
    Everything is fine, as part of a large order without errors! delivery fast, thank you!
    2021-07-10
  • Ma***in
    Poland
    I've just received the order - Thank you for quick shippment and for the gift. I am really satisfied you organized the shippment quickly and that the invoice and whole procedure on the customs went smoothly - without any problems.
    2021-04-26
  • FR***co
    Switzerland
    Perfect, thanks
    2023-11-03
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.
▪ Packing Condition Inspection and make sure all products are well anti-static sealed.
▪ Extensive views like printing and Pin checking under microscope for quality detection.
▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.
▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.

Package
Package