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TPS563219ADDFR
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Product Details
TPS563219ADDFR
IC REG BUCK ADJ 3A TSOT23-8
Manufacture: Texas Instruments
Category: IC
Description: IC REG BUCK ADJ 3A TSOT23-8
Package: SOT-23-8 Thin, TSOT-23-8
Video: TPS563219ADDFR
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

Power Management ICs of TI find the usage on helping engineers develop differentiated, innovative designs, from ultra-low-power wireless sensors to high-voltage GaN-based design. Its application areas cover Automotive, Communications equipment, Industrial, Consumer Electronics, Enterprise systems.

Reviews
MOREReviews
  • Da***id
    Israel
    Received, looks OK. Thank for the present, I will use it.
    2021-06-02
  • An***io
    Italy
    Mini,thanks for gift. We got the parcel and all good.
    2023-05-30
  • E***g
    Singapore
    Thanks for your quick and efficient delivery!
    2021-08-12
  • Va***sa
    Malaysia
    Thank you for the service and fast cooperation. We received the goods well. And many thanks for the beautiful gift. If we search another component, we will certainly communicate again.
    2021-01-28
  • Ke***an
    United States
    We counted them, we tested two of them, they work well. Thank you. We also are delighted with the little piece of art you included in the package. We're not sure what it's for, but we have put it up on our notice board, because it is cute.
    2023-04-22
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.
▪ Packing Condition Inspection and make sure all products are well anti-static sealed.
▪ Extensive views like printing and Pin checking under microscope for quality detection.
▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.
▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.

Package
Package