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LMR12007YMKX
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Product Details
LMR12007YMKX
IC REG BUCK ADJ 750MA TSOT23-6
Manufacture: Texas Instruments
Category: Integrated Circuits
Description: IC REG BUCK ADJ 750MA TSOT23-6
Package: SOT-23-THIN
Video: LMR12007YMKX
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

Texas Instruments LDO regulatorsLinear and low dropout (LDO) regulators of Texas Instruments provide regulated output voltage that is powered from a higher voltage input in a variety of applications. It helps to deal with any regulator designs from powering sensitive analog systems to extending battery life. The LDO is able to be used to help reduce noise, address voltage regulation issues caused by electromagnetic interference (EMI) and printed circuit board (PCB) routing, and improve system efficiency by turning off unneeded functions.

The applications of LDO include Consumer electronics, computers, battery-power devices, automotive, industrial, wire and wireless communication, etc.

Reviews
MOREReviews
  • Fl***an
    Germany
    Thank you very much came quickly packed well.
    2022-11-03
  • Ha***na
    Korea
    Fast delivery. All good!
    2022-11-19
  • Da***de
    Italy
    Good!
    2023-08-04
  • Pa***ki
    Poland
    Good! Fast shipping.
    2022-06-20
  • Ra***na
    Switzerland
    It has been working great in my project.
    2023-08-04
QC Process
QC Process

Selecting the right Power Management ICs is the key to the success of the projects. In order to meet the customers’ quality requirements, we promise to provide Original & New PMICs with 100% high levels of quality.

High quality Power Management ICs at Hard Find Electronics

Before shipment, products are subjected to a strict QC process.

▪ Sampling: The first step is to sample the chips to ensure they meet the specifications provided by the manufacturer.
▪ Visual Inspection: During visual inspection, the chips are inspected for any visible defects.
▪ Lable verification and packaging condition inspection.
▪ Electrical Test: Electrical tests are used to determine the performance of the chip, such as output power, efficiency, and operating temperature.
▪ Functional Test: Functional tests are used to ensure that the chips can perform their intended functions.
▪ Final Evaluation: The final step in quality control is a comprehensive evaluation of the chips to ensure that they meet all the specified requirements.
▪ Digital photos record of the products.

Each step is very rigorous and aims to ensure that all products are delivered to the expected standard of excellence and quality.

Package
Package