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BUF602IDBVT
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Product Details
BUF602IDBVT
IC BUFFER 1 CIRCUIT SOT23-5
Manufacture: Texas Instruments
Category: Integrated Circuits
Description: IC BUFFER 1 CIRCUIT SOT23-5
Package: SC-74A, SOT-753
Video: BUF602IDBVT
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

Amplifiers are devices that increase the amplitude of voltage, current, power, or input signal. TI provides a variety of amplifiers such as Operational Amplifiers, Current Sense Amplifiers, Comparators, Programmable and Variable Gain Amplifiers, Instrumentation Amplifiers, to optimize the performance and functionality of most electronic systems and offer a cost-effective solution. The applications include wireless communications and broadcasting, audio equipment, etc.

Reviews
MOREReviews
  • Yu***ov
    Germany
    We've received from you qualitative parts. which has been used in manufacutre and devices work without problems. Separate thanks for gifts! They were nice. I hope for the further successful cooperation with your company this 2022!
    2022-01-12
  • Ro***to
    Italy
    Recieved! All products are good.
    2022-10-21
  • Fa***an
    Germany
    The chip is good!
    2022-05-28
  • A***i
    Israel
    I really happy that i am working with you
    2023-04-28
  • Th***as
    Germany
    Thanks for your offer and quick response.I am sending you new quotation in attached files.
    2023-07-18
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.
▪ Packing Condition Inspection and make sure all products are well anti-static sealed.
▪ Extensive views like printing and Pin checking under microscope for quality detection.
▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.
▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.

Package
Package