Sourcing Hard Find Electronic Components
EP3SE110F1152I3
  • Product Details
  • Reviews
  • QC Process
  • Package
  • TOP
Product Details
EP3SE110F1152I3
IC FPGA 744 I/O 1152FBGA
Manufacture: Intel
Category: Integrated Circuits
Description: IC FPGA 744 I/O 1152FBGA
Package: 1152-BBGA, FCBGA
Video: EP3SE110F1152I3
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

Intel FPGA is a semiconductor integrated circuit, which allows online or remote modification and updates to complete a specific function. They offer a wide variety of configurable embedded SRAM, high-speed transceivers, high-speed I/Os, logic blocks, and routing. The applications include artificial intelligence, data centers, 5G connectivity, smart vision and video, IoT, automotive, industrial, medical, consumer electronics, etc. Intel field programmable gate array also provides security features such as key protection, data erasure, and anti-jamming features to fully protect your configurable logic designs, systems, and data.

Reviews
MOREReviews
  • Ir***in
    Finland
    Thank you very much - delivery arrived
    2022-07-20
  • Th***ry
    France
    Good!
    2023-06-20
  • Co***ot
    France
    It's good!
    2022-08-15
  • Mi***al
    Switzerland
    Good!
    2021-08-01
  • Fr***ca
    Italy
    Thanks for the shipping, everything was ok.
    2021-04-13
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

ADM acquired Xilinx - image from internet

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.

▪ Packing Condition Inspection and make sure all products are well anti-static sealed.

▪ Extensive views like printing and Pin checking under microscope for quality detection.

▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.

▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.


Package
Package