Onsemi has released new silicon MOSFETs in motor control and DC-DC converters with an innovative Top Cool package.
Leading in smart power and sensing technology, onsemi leverages its deep packaging expertise to deliver the highest power density solutions in the industry.
Source: onsemi
The Top Cool package is ideal for eliminating the PCB from the thermal path. Measures 5mm x 7mm with a 16.5mm2 thermal pad on the top side, the TCPAK57 package allows heat to be dissipated directly into a heat-sink rather than via a typically printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density and boosts reliability.
The initial portfolio of onsemi mosfets launched at electronica includes 40V, 60V, and 80V devices operating at junction temperatures of 175°C with RDS(ON) values down to 1mΩ. In addition, it is able to reduce losses in high-speed switching applications with the low gate charging (65nC).
· AEC-Q101 qualified and PPAP capable for automotive designs such as electronic power steering and oil pumps.
· Features gull wings leads to allow inspection of solder joints and improve the board level reliability.
“Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vice president and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.”
This new device improves reliability for longer overall system life. Its target application is high/medium power motor control, such as electric power steering and oil pumps.
Previous: SiC Power Modules APM32 for the Automotive Charger
The range is one of the most important issues for electric vehicles. Onsemi previously launched three SiC-based automotive power modules. The APM32 family of modules enables faster charging and greater range for all types of electric vehicles.
All three power modules feature low conduction and switching losses combined with optimal thermal resistance and high-voltage isolation to handle bus voltages of 800V. Based on SiC technology, the new module can minimize loss, improve charging efficiency, and also able to solve the problem of limited system space.
Source: onsemi
The APM32 series is specially developed for OBCs with output power from 11 to 22kW. SiC technology is used in injection-molded housing to improve efficiency and shorten charging times for xEVs. Benefiting from the advantages of onsemi's end-to-end SiC supply chain, each module is provided with a serial number for full traceability. The APM32 can operate up to a junction temperature (TJ) of 175°C, meeting demanding automotive applications.
NVXK2TR40WXT and NVXK2TR80WDT are suitable for high-voltage battery packs. Configured in an H-bridge topology with a breakdown voltage of 1200V, it is suitable for OBC and high-voltage DC/DC converters. The NVXK2KR80WDT is used in the power factor correction stage (PFC) of the OBC, and the configuration is a Vienna rectifier.
A compact and robust DIP is used on the package to ensure low module resistance. With excellent cooling and insulation, it is AEC-Q101 and AQG 324 compliant. Its creepage distance and air distance comply with IEC 60664-1 and IEC 60950-1 standard.