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EP4SGX360HF35C3N
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Product Details
EP4SGX360HF35C3N
IC FPGA 564 I/O 1152FBGA
Manufacture: Intel
Category: Integrated Circuits
Description: IC FPGA 564 I/O 1152FBGA
Package: 1152-BBGA, FCBGA
Video: EP4SGX360HF35C3N
Available to Order
Minimum: 1 Multiples: 1
1 PCS
MOQ from 1 PCS and order value from 1 USD
2 Days
Most components under 2-5days lead time
12 Hours
Fast quotation within 12 hours
365 Days
365 Days full quality warranty
Applications
  • Applications
  • Related Components

Intel FPGA is a semiconductor integrated circuit, which allows online or remote modification and updates to complete a specific function. They offer a wide variety of configurable embedded SRAM, high-speed transceivers, high-speed I/Os, logic blocks, and routing. The applications include artificial intelligence, data centers, 5G connectivity, smart vision and video, IoT, automotive, industrial, medical, consumer electronics, etc. Intel field programmable gate array also provides security features such as key protection, data erasure, and anti-jamming features to fully protect your configurable logic designs, systems, and data.

Reviews
MOREReviews
  • Ma***in
    Poland
    I've just received the order - Thank you for quick shippment and for the gift. I am really satisfied you organized the shippment quickly and that the invoice and whole procedure on the customs went smoothly - without any problems.
    2021-04-26
  • Na***ia
    Russia
    Well received the goods, thanks for arrange the fastest method so we can catch up the project.
    2023-04-18
  • Mi***el
    Spain
    Good!
    2022-07-18
  • Ra***na
    Switzerland
    Good!
    2023-07-18
  • Ha***ns
    Germany
    Good!
    2022-01-05
QC Process
QC Process

Based on our quality policy, we work to achieve 100% high levels of quality.  In order to meet our customers' quality requirements, our several quality control checks handle everything throughout distribution process.

Prior to shipping, products are subjected to be conducted Visual Inspection by quality inspectors for their Packing, Label, Marking, Footing and Function, etc.

ADM acquired Xilinx - image from internet

Our Integrated Circuit Systems inspection procedure includes

▪ Label verification according to data sheet. Make sure Logo, PN, D/C, LOT No, MSL, RoHS etc on the label are correct.

▪ Packing Condition Inspection and make sure all products are well anti-static sealed.

▪ Extensive views like printing and Pin checking under microscope for quality detection.

▪ Conduct additional test like electrical testing or other technical testing for further guarantee via our in-house, certified test labs.

▪ Digital photos of all outgoing Integrated Circuit Systems parts.

Each step is very rigorous and aims to ensure that all products are delivered in the expected standard of excellence and quality.


Package
Package